Photonics West On-Demand

Photonics West On-Demand

The online version of Photonics West 2022 takes place February 21-27, 2022. The conference will hold an on-demand week that will cover biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication,

SPIE safely welcomed the international photonics community back to San Francisco’s Moscone Center from 22-27 January for Photonics West. The largest annual photonics conference and exhibition, including its BiOS, LASE, and OPTO symposia and the AR|VR|MR conference, garnered more than 10,000 registered attendees, hosted more than 950 exhibitors, and included 2,100 technical presentations.

“We very much appreciate all the support from exhibitors, attendees, volunteers, and presenters who truly made the event a success,” said SPIE CEO Kent Rochford. “Everyone embraced San Francisco’s health and safety protocols, resulting in a safe meeting. There’s nothing like coming home to Photonics West, and the enthusiasm we witnessed throughout the week proves that there is nothing like in-person events.”

In addition to breakthrough science and engineering conference presentations throughout the week, both the BiOS and Photonics West exhibitions enjoyed a robust flow of returning, new, and potential customers eager to discuss requirements face-to-face with the world’s top suppliers of optics and photonics technology.

Much of this information will be available during the On-Demand version of the show later this month.

Plenary Topics Include:

Nano/Biophtonics presented by Hongjie Dai of Stanford University

Opto Plenary presented by Amano of Nagoya University, Vuckovic of Stanford University, Blanco-Redondo of Noika Bell Labs.

BiOS and Neurotechnologies by leaders and innovators from both communities.

Highlighted Exhibitors:

Heidenhain Corporation

Heidenhain offers the latest MULTI Degrees-of-Freedom (MULTI-DOF) motion control components, offering manufacturers a better way to implement metrology designs.

With MULTI-DOF technology, machine manufacturers can now obtain multiple measurements simultaneously and facilitate correcting deviations on the fly. These products include the LIP 6031 Dplus, the GAP 1081 and the MKV 1/9×30. Conventional encoders offer one degree of motion, but these three new components do more to serve the demanding requirements of machines in the electronics and semiconductor industries, among others.

Armadillo SIA

Armadillo SIA, a provider of specialized optical fibers, sub-assemblies, and hybrid photonic solutions, offers Multi-Core Optical Fiber: Silica/Silica Concentric Core Fibers for laser power delivery. Multi-Core Optical Fibers used for applications in laser power delivery offer control of power density and laser beam shape by using different cores, or multiple cores simultaneously.

These features make Multi-Core Optical Fibers ideal for processing various sheet metal materials and thicknesses. Armadillo SIA offers a range of fully customizable concentric multi-core optical fibers, including non-circular multi-core shapes, which are engineered to meet customers’ requirements.

According to Armadillo SIA’s business development manager, Mario Paredes, “There are different optimum power densities for processing sheet metals, depending on the material and the thickness. Our concentric multi-core optical fibers make power density adjustments possible, while also providing increased precision. We offer a huge advantage over our competitors with our full range of customization options for our multi-core optical fibers.”

Silica/Silica Concentric Core Fibers feature multi kW power tolerance, non-circular core shape options, power density control, increased precision, a step-index profile, and special jackets that operate in high temperatures, high vacuum and harsh chemical environments.

Physik Instrumente (PI)

PI solutions include everything from 3D printing to photonics alignment as well as industrial automation to in vitro diagnostics.

Photonics-based computing offers significant advantages in terms of lower energy consumption and faster data transmission. Cost-effective mass production of photonic integrated circuits (PICs) requires precise positioning and high alignment speed when it comes to wafer-probing, fiber-chip coupling, and packaging. The setup for multi-channel automated fiber assembly, based on the proven double-sided F-712.HA2 fiber alignment system and PI´s multi-axis gantry system, offers an idea for further workflow automation.

PI’s modular hardware and ACS EtherCAT-based controller architecture allow OEMs to construct really high performance and safe automation assemblies of arbitrary complexity. Alternatively, PI’s Engineered Subsystems Group stands ready to assemble and ship custom automation subassemblies like the one demonstrated here – ideal for OEMs preferring to focus on their value-added.

Learn more about these technologies at:

Categories: Revolutions

About Author

Matthew Jaster

Matthew Jaster, Senior Editor, has a B.A. in journalism from Columbia College Chicago and has 15+ years of writing and editing experience in automotive, manufacturing, engineering, law and arts and entertainment.

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